GIGABYTE Ultra Durable 3 design, featuring 2 ounces of copper for both the Power and Ground layers which dramatically lowers system temperature by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. GIGABYTE's Ultra Durable 3 also lowers the PCB impedance by 50%, which helps to reduce electrical waste and further lowers component temperatures. A 2oz Copper layer design also provides improved signal quality and lower EMI (Electromagnetic Interference), providing better system stability and allowing for greater margins for overclocking.