AMD Opteron 6000 Series Platform
Performance for demanding workloads
Match tough workloads with the right fit server platform, and realize superior performance in memory and compute intensive workloads.
Consistent platform that scales:
Take control now with Direct Connect 2.0 architecture consistency, including power, virtualization and memory innovations, and socket compatibility with planned AMD Opteron 6200 Series processor.
Business value without compromise:
Gain advantages normally reserved for high-end systems, with exceptional value, low total cost of ownership, and generational consistency.
Target: Enterprise Class 2-way and 4-way Servers
a.Twelve-core and Eight??ore, L2 ??512K/core, L3 - 12MB of shared L3 Cache
b.AMD CoolCore technology, AMD PowerNow! technology, Enhanced C1 state, AMD CoolSpeed technology, APML (in APML enabled platforms)
c.Quad-Channel U/RDDR3 & LV U/RDDR3, ECC, support for on-line spare memory
d.Supports up to 3 DIMMs/channel, up to 12 DIMMS per CPU
e.Planned platforms 2P/2U, 2P Tower, 4P rack, 4P Blade
Single Series for performance DP and MP platforms
a.2P economics for 4P servers
b.Compelling price/performance for volume market
G34 Socket Infrastructure
a.Balanced performance with power/thermals
b.Quad 16-bit HyperTransport 3 technology (HT3) links, up to 6.4 GT/s per link
c.AMD SR56x0 chipset with I/O Virtualization and PCIe 2.0
Direct Connect Architecture 2.0:
a.Quad Channel Memory offers double the memory capacity and memory bandwidth of previous generations of AMD OpteronTM processors2.
R/U-DDR3 Memory up to 1333 enables improved overall system performance compared to earlier memory technologies.
b.HyperTransport Technology Assist [HT Assist] helps increases HyperTransport technology efficiency by reducing probe traffic and resolving probe issues.
c.HyperTransport 3.0 Technology (HT3) with 4th HT Link and increased speed, up to 6.4GT/s provides superior system bandwidth between CPU?? and I/O to help improve system balance and scalability.
d.Increased Cache and Core Count of up to 12 cores within the same package offers improved performance and performance/watt compared to prior generations for multi-threaded environments such as virtualization, database and web serving.
New AMD-P 2.0 Power Savings Features:
a.APML (Advanced Platform Management Link)3 provides an interface for processor and Systems Management monitoring and controlling of system resources such as platform power consumption via p-state limits and CPU thermals to closely monitor power and cooling.
b.AMD CoolSpeed Technology reduces p-states when a temperature limit is reached to allow a server to operate if the processor?? thermal environment exceeds safe operational limits.
c.C1E provides a sleep state that can equate to significant power savings in the datacenter depending on system configuration.
d.LV-DDR3 memory support helps to reduce overall system power consumption.